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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore: Woodhead Publishing Series in Electronic and Optical Materials

Autor Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao
en Limba Engleză Paperback – 15 noi 2019
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.


  • Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging
  • Features experimental characterization and qualifications for the analysis and verification of electronic packaging design
  • Provides multiphysics modeling and analysis techniques of electronic packaging
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Specificații

ISBN-13: 9780081025321
ISBN-10: 0081025327
Pagini: 434
Dimensiuni: 151 x 229 x 30 mm
Greutate: 0.58 kg
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials


Cuprins

1. Introduction
2. Electrical modeling and design
3. Thermal modeling, analysis, and design
4. Stress and reliability analysis for interconnects
5. Reliability and failure analysis of encapsulated packages
6. Thermal and mechanical tests for packages and materials
7. System-level modeling, analysis, and design